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Hackers breach Wi-Fi network of U.S. firm from Russia — daisy chain attack jumps from network to network to gain access from thousands of miles away

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TSMC won’t adopt advanced High-NA EUV chipmaking tools until 2030 or later — Intel just received its first tool this week: Report

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According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later.

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