Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize the memory industry as we know it today. Neo estimates that its 3D X-DRAM tech can achieve 128Gb density which is 8 times greater compared to today’s best solutions with DDR5 technology.
3D stacking of silicon has been
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Author: Aaron Klotz
