3D X-DRAM aims for 10x capacity of today’s memory — NEO Semiconductor’s memory has up to 512 Gb per module Tech News Eulis May 7, 2025 NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing. Go to Source Author:
