TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models Tech News Eulis April 24, 2025 TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors. Go to Source Author:
Lord of the Rings Online activates 18th anniversary celebrations while working on a tool for missing loot