TSMC ‘Super Carrier’ CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks Tech News Eulis November 27, 2024 TSMC’s CoWoS gets even bigger with 9-reticle size packages due in 2027. Go to Source Author:
Washington D.C. gets AI-enabled air defense camera upgrade — new system replaces 22-year-old cameras installed after 9/11
Despite restrictions, Russia allegedly finds new way to produce sanctioned 48-core Baikal-S processors: Report