It seems Taiwan Semiconductor Manufacturing Company (TSMC) is right on schedule to begin mass producing silicon based on its 3-nanometer process next year, which will pack 1.7 times the logic density of its 5nm node. Barring any snags, TSMC expects to churn out 30,000 wafers in the latter half of this year, as 3nm production enters the risk
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Author: Paul Lilly
