Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUs Tech News Eulis October 4, 2024 Amkor will offer TSMC’s advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S. Go to Source Author:
Nvidia CEO and execs cash in on $1.8 billion worth of Nvidia stock — largest stock sale in chipmaker’s recent history