Breaking News

SK Hynix Secures US Funding For A $3.9B AI Chip Packaging Facility In Indiana

SK Hynix Secures US Funding For A $3.9B AI Chip Packaging Facility In Indiana
SK hynix is on track to receive hundreds of millions of dollars in funding from the US CHIPS and Science Act to help pay for a semiconductor packaging plant in Indiana. In total, SK hynix plans to invest $3.87 billion on the production base that will churn out AI memory products on US soil, and contribute to a “more resilient supply chain

Go to Source
Author: Paul Lilly