TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI Tech News Eulis April 30, 2024 TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs. Go to Source Author:
‘If buying isn’t owning, piracy isn’t stealing,’ say gamers reviewbombing the remaining The Crew games
