TSMC considering advanced packaging facility in Japan: report — with two fabs already in the works, this would be a major boost to country’s chip industry Tech News Eulis March 18, 2024 After building chipmaking fabs, TSMC reportedly considers an advanced chip packaging facility in Japan. Go to Source Author:
Ravendawn To Balance Market Oversupply Issue from Land, and Get its First PTR Ahead of ‘Mini Expansion’ PvP Patch
