$300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology Tech News Eulis February 28, 2024 The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D. Go to Source Author:
Intel puts 1nm process (10A) on the roadmap for 2027 — also plans for fully AI-automated factories with ‘Cobots’