SK hynix is showing off a sample of its 321-layer 1-terabit (Tb) triple-level cell (TLC) “4D” NAND chips, which is notable because it’s the first time a chip maker has stacked over 300 layers of NAND flash memory. The demonstration took place this week during the Flash Memory Summit (FMS) 2023 event in Santa Clara, though mass production isn’t
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Author: Paul Lilly
