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Samsung to adopt hybrid bonding for HBM4 memory

Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

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All New Branch Privilege Injection For Every Intel CPU Since The Coffee Lake Refresh

Lord of the Rings Online delays the Sting server again, now to May 21, as it addresses missing items

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