AMD is still on track to launch its next-generation Ryzen 7000 processors this fall, which means there are engineering samples out in the wild. It seems an overclocker has taken one of those ES chips (or perhaps even a qualification sample, though that’s less likely) and ripped the integrated heat spreader (IHS) off the Zen 4 part, exposing
Maker and developer James Brown has brought the computer terminal LEGO brick to life with a custom PCB that uses an ARM Cortex-M0 microcontroller and super tiny OLED display.
An overclocker reportedly took this photo after delidding a new Ryzen 7000 CPU, ready for some extreme overclocking fun. Hopefully, this means the benchmarks will leak, too.
Houston, we are go for launch. That’s the message that NovaQuark has for its Dual Universe community. The studio said that after assessing the state...