HiFive Premier P550 Review: High RISC
Touted as ‘The Highest Performance RISC-V CPU Development Board in the World’, the HiFive Premier P550 aims to be the development board of choice for RISC developers.
Linux kernel source expands beyond 40 million lines – it has doubled in size in a decade
The Linux kernel sources expanded beyond 40 million lines with the release of 6.14 rc1.
A version of Snake only playable with a microscope has been made — Meet Subpixel Snake
A developer created a version of Snake that relies on animations at the sub-pixel level.
Microsoft experiments with ‘Drag Tray’ — share menu appears when dragging a file in Windows 11
Microsoft added a ‘Drag Tray’ to a Windows 11 Insider Preview to make it easier to share files from the File Explorer.
MSI Afterburner 4.6.6 Beta 5 adds Nvidia RTX 50 plus initial Arrow Lake and Zen 5 support
MSI Afterburner now supports Nvidia’s latest RTX 50 GPUs and adds quad-fan control functionality.
MSI optimizes affordable Intel 800 mobos for China’s first homegrown DDR5 memory chips
MSI recently launch several B860 motherboards with BIOS optimized for CXMT DDR5 memory.
AMD FSR 3.1 game titles ‘should just work’ with FSR 4 drop-in DLL file replacement hints leaker
AMD FSR 4 retroactive support for FSR 3.1 titles is confirmed and explained.
Apple Slapped With Lawsuit Over Toxic Chemicals In Its Watch Bands
Apple is currently embroiled in a class action lawsuit that alleges the company included toxic chemicals known as PFAS (per-and polyfluoroalkyl substances) in its watch bands. This lawsuit follows a study that found elevated levels of perfluorohexanoic acid (PFHxA), a type of PFAS, in nine out of 22 tested watch bands. It also revealed that
E6 Claims Its Groundbreaking Copper-Diamond Heatsinks Will Keep Chips Chill
Element Six (E6), a subsidiary of the ever-dominant De Beers Group, just put out a press release unveiling its new “Copper Diamond Composite Material” (Cu-Diamond composite), a material it claims can revolutionize cooling solutions for high-performance computing (HPC) chips and GaN RF devices. This shiny innovation promises high thermal and
More Xbox first-party games will come to PlayStation and Nintendo — Xbox hardware will remain
Xbox head Phil Spencer reaffirms the company’s desire to release more multiplatform games while maintaining a hardware platform.