If you hear that there’s new content coming to Star Trek Online, you probably assume new featured episodes, new reputations, maybe a task force or two....
TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expansion to meet increasing demand for AI accelerators.
MIT’s 3D-printed triaxial electrospray nozzles could revolutionize drug and self-healing material manufacturing. By using a relatively inexpensive resin printing approach, the new nozzle fabrication technique removes the need for a semiconductor-class cleanroom facility.