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Nvidia details its upcoming Quantum-X InfiniBand and Spectrum-X Ethernet switches that will adopt co-packaged optics by 2026 to deliver up to 409.6 Tb/s bandwidth at lower power than traditional pluggable module.
Researchers at imec and Ghent University have stacked 120 ultra-thin layers of silicon and silicon-germanium, a key step toward 3D DRAM. Using advanced epitaxial techniques, they controlled atomic strain to create a nanoscale “skyscraper” of memory, paving the way for denser, faster chips.
The growing formation of unions across Microsoft’s game studios, particularly at Blizzard, has been something we’ve been keeping a track of for some time, and...